16-05-2024 | Empower Semiconductor | Passives
Empower Semiconductor has unveiled the largest silicon capacitor in its ECAP product family for high-frequency decoupling. The new EC1005P is a single 16.6μF capacitance device appropriate for the most demanding power integrity targets as often found in high-performance SoCs. It features ultra-low impedance up to 1GHz in a low profile that can be embedded into the substrate or interposer of any SoC, making it ideal for HPC and AI applications.
"The performance of SoCs and other large computing processors are constantly increasing," said Mukund Krishna, senior manager of product marketing, Empower Semiconductor. "It is becoming increasingly difficult to reach the level of power integrity and voltage regulation that these devices require with conventional MLCCs. The EC1005P features close-to-ideal parasitic parameters, allowing these SoCs to operate with reduced voltage margining and ultimately reducing system power."
The device uses the company's high-performance and high-density silicon capacitor technology to fulfil the 'last inch' decoupling gap from the voltage regulators to the SoC supply pins. This approach substitutes several discrete components with considerably lower performance and a larger footprint with a single monolithic device that provides optimal electrical performance and simplifies engineering complexity.
The device has an ultra-low sub-1pH ESL and sub-3mOhm ESR and is supplied in a compact 3.643mm x 3.036mm 120-pad chip-scale package. The device comes in a standard profile of 784-micron that can be customised for various height requirements. The company’s industry-leading silicon capacitors provide high stability over voltage and temperature and are not subject to derating or ageing like traditional MLCCs.
