Harwin introduces BBI Range for Industrial and Embedded Apps at Embedded World 2023

In this video, Robert Mitchell from Electropages interviews Sam Bennett from Harwin at Embedded World Nuremberg. They discuss Harwin's new product range, BBI, which stands for board-to-board interconnect. This range is designed for industrial use in embedded applications and high reliability, high volume, small pitch applications. The Arch 0.5 Series and the Arch 0.8 Series are capable of carrying high-speed data transfers of up to 8 gigahertz and 12 gigahertz, respectively. Both families are applicable to USB 3.2, HDMI 2.0, and SATA 3 industry standards of data transfer.

The connectors are tested for vibration and are capable of handling severe levels of vibration, shock, and high reliability found in automotive, UAVs, space applications, and medical industries. The range features varying levels of locking and is reusable for up to 100 mating cycles. The Gecko MC is particularly used in satellites and drones.

Harwin is also developing floating connectors that self-align during mating, avoiding damage and keeping signal integrity throughout the circuit. For more information, visit Harwin's website for free CAD downloads, free sampling, and technical support.

Link to Harwin's website: https://www.harwin.com/