New backplane connectors support faster data rates

Molex has augmented its Impel backplane connector family with the new Impel Plus backplane connector range, which now integrates grounding tail aligners and smaller signal compliant pins. The innovative signal beam design improves insertion loss compared to in-line beams and pushes interface resonance frequency past 30GHz. In today’s market, telecom and data computing OEMs must deliver ever-faster data rates, but those higher speeds can produce insertion loss and degraded signal integrity (SI) performance. OEMs also need to design scalability into their equipment to minimise future infrastructure investments. By delivering optimal SI, reducing crosstalk, and improving insertion loss, the Impel Plus daughtercard module design resolves those key performance issues. In addition, as the connectors are both backwards and forwards compatible, OEMs can meet future data rate needs without replacing infrastructure. “Impel Plus daughtercard modules are designed as an upgrade path to the standard Impel modules, and will be available to OEMs to support future speed bumps or to provide for higher margins in their current systems,” said Bratislav Kostic, new product development manager, Molex. “Our patent-pending technology, with a tightly coupled differential-pair structure, provides optimal signal integrity and mechanical isolation throughout the connector system.” The new connectors are ideal for applications in several markets, including telecom and networking (hubs and servers); medical (patient monitoring), and aerospace/defence. Impel Plus connectors are compliant with IEEE 100GBASE-KR, 100GBASE-KP and the Optical Internetworking Forum (OIF) CEI-25G-LR, says the company.