Improve product quality and yield with 3D automated optical inspection

You can count on DLP technology, from Texas Instruments, to deliver 3D AOI and solder paste inspection (SPI) solutions for the PCB industry by providing high accuracy with short scan times for area based 3D inspections. DLP optical MEMS provide extremely flexible and fully programmable structured light projection with exceptional contrast and with the product longevity gained from our proven technology. Plus, leverage support from DLP design network companies for quicker time to market. The solution offers reliable optical MEMS solution with scalable resolution and speed offerings. The strong DLP ecosystem features programmable and flexible sequencing for structured light pattern generation.