03-03-2025 | ROHM Semiconductor | Power
ROHM has developed 650V GaN HEMTs in the TOLL. package: the GNP2070TD-Z. Featuring a compact design with exceptional heat dissipation, high current capacity, and superior switching performance, the TOLL package is increasingly being adopted in applications that need high power handling, particularly inside industrial equipment and automotive systems. For this launch, package manufacturing has been outsourced to ATX Semiconductor (Weihai) Co., Ltd. (ATX), an experienced OSAT provider.
Improving the efficiency of motors and power supplies, which account for most of the world's electricity consumption, has become a considerable challenge to attaining a decarbonised society. As power devices are key to improving efficiency, adopting new materials such as SiC and GaN is expected to further enhance the efficiency of power supplies.
The company began mass production of the first generation of its 650V GaN HEMTs in April 2023, followed by the release of power stage ICs that combine a gate driver and 650V GaN HEMT in a single package. This time, it has developed the product incorporating second generation elements in a TOLL package, and added it to existing DFN8080 package to strengthen its 650V GaN HEMT package lineup – meeting the market demand for even smaller and more efficient high-power applications.
The new products integrate second generation GaN-on-Si chips in a TOLL package, attaining industry-leading values in the device metric that correlates ON-resistance and output charge (RDS(on) × Qoss). This contributes to further miniaturisation and energy efficiency in power systems that need high voltage resistance and high-speed switching.
To achieve mass production, the company used proprietary technology and expertise in device design, cultivated through a vertically integrated production system, to carry out design and planning. Under the collaboration, front-end processes are carried out by TSMC. Back-end processes are handled by ATX. On top, ROHM plans to partner with ATX to produce automotive-grade GaN devices.
In response to the increasing adoption of GaN devices in the automotive sector, which is expected to accelerate in 2026, the company plans to ensure the rapid introduction of automotive-grade GaN devices by strengthening these partnerships and advancing its development efforts.
Liao Hongchang, director and general manager, ATX, said: "We are extremely pleased to have been entrusted with production by ROHM, a company renowned for its advanced manufacturing technologies and in-house production facilities that cover everything from wafer fabrication to packaging. We began technical exchanges with ROHM in 2017 and are currently exploring possibilities for deeper collaboration. This partnership was made possible due to ATX's track record and technical expertise in the back-end manufacturing of GaN devices. Looking ahead, we also plan to collaborate on ROHM's ongoing development of automotive-grade GaN devices. By strengthening our partnership, we aim to contribute to energy conservation across various industries and the realisation of a sustainable society."
Satoshi Fujitani, general manager, AP Production Headquarters, ROHM, said: "We are delighted to have successfully produced 650V GaN HEMTs in the TOLL package, achieving sufficient performance. ROHM not only offers standalone GaN devices but also provides power solutions that combine them with ICs, leveraging ROHM's expertise in analog technology. The knowledge and philosophy cultivated in the design of these products are also applied to device development. Collaborating with OSATs such as ATX, that possess advanced technical capabilities, allows us to stay ahead in the rapidly growing GaN market while utilising ROHM's strengths to bring innovative devices to market. Going forward, we will continue to enhance the performance of GaN devices to promote greater miniaturisation and efficiency in a variety of applications, contributing to enrich people's lives."
Application Examples include Power supply for servers, communication base stations, industrial equipment and more.