Gold-germanium solder performs well at the elevated operating temperatures
09-06-2017 |
Indium Corporation
|
Subs & Systems
Indium Corporation’s high melting point AuGe solder preforms perform well at the elevated operating temperatures of smaller dies with increased power densities. In addition, improvements in wetting make semiconductor-grade AuGe solder preforms critical for void reduction efforts.
Gold-based solders have a melting point ranging from 280C-1064C, making them compatible with subsequent reflow processes. Additionally, gold-based solders are resistant to corrosion, provide superior thermal fatigue resistance, and exhibit excellent joint strength.
The company’s Pb-free and RoHS-compliant preforms are available in a variety of standard and custom-engineered designs.
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