Indium Corporation


Solder preform technology enables lower processing temperatures

Indium Corporation introduces a novel alloy technology for lower processing temperatures in preform soldering. Specifically created for power module package-attach applications, In

Industrial | 14-11-2023

LED paste introduced for advanced mini/microLED applications

Indium Corporation has extended its portfolio of proven pastes with a new no-clean, halogen-free solder paste developed for advanced LED applications, incorporating COB, COG, SMT,

Industrial | 09-12-2022

New fast-wetting and no-clean flux-cored wire for robotic and manual soldering

Indium Corporation now offers the CW-818, a uniquely formulated no-clean, high-reliability flux-cored wire developed to minimise cycle times in manual and robotic soldering process

Subs & Systems | 19-08-2022

AuSn pastes for the higher processing temperatures of high-power LEDs

Indium Corporation has extended its portfolio of pastes with two new AuSn pastes created for the higher processing temperatures, and assembly needs required for usage in high-power

Subs & Systems | 16-06-2022

Expanded fine flux-cored wire capabilities for demanding requirements

Indium Corporation has extended its manufacturing capabilities to include a fine diameter 0.004” (0.1mm) flux-cored wire made with preferred Pb-free alloys to assist customers to m

Subs & Systems | 31-01-2022

Jetting solder paste designed for halogen-free no-clean SAC305 solder paste

Indium Corporation’s latest jetting solder paste, PicoShot NC-5M, has gained official approval from Mycronic as a qualified jetting solder paste. The paste and its associated purgi

Subs & Systems | 23-02-2021

New fast-wetting and low-spatter flux-cored wire for robotic and laser soldering

Indium Corporation now offers its CW-232, a uniquely formulated flux-cored wire that blends superior wetting speed and spread with remarkably low-spatter performance. The product i

Subs & Systems | 22-01-2021

New jetting solder paste for jetting systems and repair modules

Indium Corporation's PicoShot NC-5M is created for customers requiring a no-clean halogen-free SAC305 solder paste for Mycronic jetting systems or add-on and repair modules. This j

Subs & Systems | 30-01-2020

New low-temperature alloy technology offers high-performance and high-reliability

The Indium Corporation Durafuse LT is a novel, low-temperature alloy system created to give high-reliability in low-temperature applications that require a reflow temperature below

Subs & Systems | 25-11-2019

New no-clean and halogen-free flux now available

Indium Corporation has released TACFlux 108HF, a new no-clean, halogen-free, high tack force flux for hand soldering and rework applications. The flux is compatible with SAC Pb-fre

Subs & Systems | 05-11-2019

Elements of Indium offers limitless applications

Indium Corporation is a major provider of indium metal and associated technologies. Due to its unique properties if offers virtually limitless applications – indium metal is all ar

Subs & Systems | 14-08-2019

Non-silicone-based TIM for burn-in and test applications

Indium Corporation has added to its range of thermal interface materials (TIMs) with the introduction of HSMF-OS, a non-silicone based metal/polymer material produced for burn-in a

Subs & Systems | 04-07-2019

Gold-germanium solder performs well at the elevated operating temperatures

Indium Corporation’s high melting point AuGe solder preforms perform well at the elevated operating temperatures of smaller dies with increased power densities. In addition, improv

Products | 09-06-2017