30-01-2020 | Indium Corporation | Subs & Systems
Indium Corporation's PicoShot NC-5M is created for customers requiring a no-clean halogen-free SAC305 solder paste for Mycronic jetting systems or add-on and repair modules. This jetting solder paste is the first material to come out of the company’s new partnership with Mycronic.
The product is a no-clean halogen-free solder paste approved after joint company technical development with Mycronic’s MY 600/700 jetting systems. The product can be employed in standalone applications, including SiP, jetting into cavities, shield attach, stencil-replacement, and microBGA. It also complements the stencil printing of Indium8.9HF. Created as a no-clean solder paste, it can be cleaned easily with industry-standard cleaning solutions.
The product’s formulation meets or exceeds ANSI/IPC J-STD-004B ROL0 requirements; halogen-free requirements per IPC and IEC61249-2-21 standards; and IPC standards for SIR and ECM.
Furthermore, the product provides outstanding jetting performance for a halogen-free Pb-free solder paste, and reflows in air or nitrogen (ppm O2 level from 50-1,000). The product has a clear residue with minimal flow-out; significantly reduces of HIP. It also removes or significantly reduces graping and minimises reflow spatter.
