Three-dimensional moulded interconnect devices suited to Industry 4.0 applications

Multiple Dimensions’ three-dimensional moulded interconnect devices are a welcome addition to conventional PCBs that are particularly well suited to Industry 4.0 applications. An example of a smoke detector illustrates how design and functional integration are simplified with this technology. Whether rigid or flexible, PCBs are a virtually indispensable part of electronic devices as interconnect devices. Plastic MIDs offer many advantages with regard to connection technology, including the combination of electrical and mechanical functions in a single component. This makes it possible to use the housing and other moulded inner structures as an interconnect device, sometimes eliminating the need for a PCB. The MID is a multifunctional component with sensors arranged and aligned with a high precision combined with an RFID antenna for sending and receiving signals. This concentration of functions on a single carrier material enables development engineers to create three-dimensional microelectromechanical systems (MEMS). MIDs are ideally suited for this purpose, particularly when manufacturing large and very large volumes.