New AOI system offers faster inspection speed, higher precision and performance

YAMAHA has launched its YSi-V 12M Type HS2 high-end hybrid AOI system. The machine offers faster inspection speed, higher precision, and enhanced capacity and performance for specular components. Development of the system targeted faster processing through improved image processing hardware and image inspection algorithms; as a result, it has achieved more than 25% increase in 3D inspection speed when compared to the existing model, and delivers a significant speed increase of up to 40% for PCBs with high component mounting density. New features include a high-precision mode, enabling capture of clear three-dimensional images. The high-precision 7 µm resolution camera includes an all-new design dedicated 3D image capture projector optical system, significantly improving form reproducibility of extremely small-sized components down to 008004 size, and increasing height measurement repeatability. In addition, the optimization of image capture parameters and the use of newly-developed algorithms has enabled inspection capacity and performance compatible with thin, highly-integrated WLCSP and FOWLP components, whose use has risen dramatically since last year. The system is user-friendly and quick to program, but also offers the customer greater flexibility. For example, the user can decrease 3D speeds, allowing the user to either reduce cycle time or increase 3D inspection, resulting increased inspection capability. This allows more flexibility for the customer by allowing more programming options.