New Bluetooth low energy IC for automotive applications
08-12-2017 |
Toshiba
|
Semiconductors
Toshiba Electronics Europe has new IC that is compliant with Bluetooth Low Energy core specification 4.2 including support for secure connection, LE privacy features and extended packet length support. It is ready for use in extended temperature ranges and harsh automotive environments. The mixed-signal TC35679IFTG contains both analog RF and baseband digital parts to give a total solution in a single, compact and low-profile, 40-pin 6mm x 6mm x 1mm QFN ‘wettable flank’ package, with a pin pitch of 0.5mm.
A key feature of the TC35679 is its ability to form part of complex systems as a result of 17 GPIO lines and many communications choices including SPI, I2C and a 921.6kbps, two-channel UART. The GPIO lines offer access to a range of on-chip features including a wake-up interface, four-channel PWM interface, six-channel AD converter and the capability to control the control interface of an arbitrary external power amplifier for applications requiring a longer reach. On-chip DC-DC converter or LDO circuits change the external voltage supply to the required values on-chip.
Current applications cover remote key systems and reducing cables by providing a solid wireless connection to sensors. The device will also aid remote connection to diagnostic equipment, creating a Bluetooth ‘soft’ OBD port, thereby saving the weight and cost of the associated cabling and OBD connector.
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