Thermal EMI absorbers suppress difficulties causing board level EMI issues

Offered by Mouser, the Laird Technologies CoolZorb is used as a conventional thermal interface material between a heat source such as an IC and heat sink or other heat transfer device or metal chassis. The material functions to suppress unwanted resonances, energy coupling, or surface currents causing board level EMI issues. The hybrid absorber/thermal management material of the series is created using a silicone gel binder that gives inherent tack typical of conventional thermal gap fillers. The filler particle structure imparts both thermal conductivity and EMI suppression in the microwave frequency range with excellent attenuation performance at or above 3GHz. The material passes UL94V0 requirements and is RoHS and REACH Compliant. The performance edge comes from dual functional properties of EMI reduction and raised thermal conductivity. Greater signal integrity due to a decrease temperature stability, EMI, and low outgassing properties of the product improve the dependable performance of electronics. With improved EMC performance, the material results in a cost-effective solution while still satisfying compliance requirements.