COMs with built-in cloud functionality enable engineers to build space-constrained systems

Mouser is now stocking Express-BD7 COMs from ADLINK Technology, a Premier Member of The Intel Internet of Things Solutions Alliance. The COMs enable engineers to build space-constrained systems in industrial automation and data communication which include edge computing, virtualization or other numerical applications, requiring high-density CPU cores balanced by reasonable power consumption. The COM devices are designed around the Intel Xeon processor D and Intel Pentium processor D SoCs and based on the latest PICMG COM Express 3.0 specification with Type 7 pinout. The Type 7 pinout excludes graphics support offered in Type 6 and replaces it with up to four 10GbE ports and an extra eight PCIe ports for a sum of up to 32 PCIe lanes. The device has dual stacked SODIMM sockets supporting up to 32GBytes of DDR4 ECC (or non-ECC) memory, and interface options incorporate USB 3.0/2.0 ports and SATA 6Gbps ports with support for SMBus and I2C. The module also highlights built-in SEMA Cloud functionality, which allows remote monitoring, custom data collection, autonomous status analysis, and initiation of appropriate actions in distributed devices. All collected data, which includes sensor measurements and management commands, is accessible from any place, at any time via encrypted data connection. The COM is supported by the ADLINK COM Express Type 7 Starter Kit Plus, which incorporates everything required to create and develop COM Express systems based on Type 7 modules.