Ceramic capacitors in modular flex-assembly technology

TDK Corporation has extended the lineup of CeraLink capacitors with CeraLink FA types in modular flex-assembly technology. This space-saving form connects two, three or ten identical capacitors in parallel over the same terminals to increase the capacitance. The new FA types are offered for rated voltages of 500VDC, 700VDC and 900VDC. Depending on the voltage and number of capacitors, this results in rated capacitance values of between 0.5µF and 10µF. One distinct feature of these capacitors based on PLZT ceramics is their high allowable operating temperature of 150C. The FA types have a width of 7.4mm and a height of 9.1mm; while the lengths are 6.3mm, 9.3mm or 30.3mm. Despite their small size, they offer a ripple current capability of up to 47ARMS. One significant advantage of parallel switching is the extremely low ESR values that are significantly below 10mOhm at high frequencies in the range from 0.1MHz to 1MHz. With a minimum of 3nH, the ESL values are also extremely low. Thanks to their low parasitic effects, the capacitors are perfectly suited for converter topologies by fast-switching semiconductors such as GaN or SiC. Voltage overshoots when switching are particularly lower than with conventional capacitor technologies. Special demands regarding size, current capability and temperature can also be reached very easily with these capacitors.