29-12-2021 | Parker Chomerics | Subs & Systems
The Chomerics division of Parker Hannifin Corporation has introduced its next generation of thermal gap filler pads - THERM-A-GAPTM PAD 30 and 60 - for all heat transfer applications between electronic components and heat sinks.
With a reliable thermal performance of 3.2W/m-K, the cost-effective THERM-A-GAP PAD 30 conforms to rough surface irregularities and air gaps on heat-generating components. For higher performance applications, THERM-A-GAP PAD 60 delivers the attractive combination of exceptional thermal conductivity at 6W/m-K while being 40% softer than existing high-performance thermal gap pad offerings from the company.
The unique formulation ensures complete conformability (with low clamping forces) and the lowest outgassing, therefore offering an effective thermal interface wherever uneven surface irregularities, air gaps or rough textures are dominant. The products are perfect for general industrial, life science and consumer markets.
“Thermal gap filler pads continue to be designed and used in greater capacities for price-sensitive markets, as well as those requiring high-performance materials,” says Brian Mahoney, thermal business unit manager, Chomerics Division. “We’re thrilled to expand our already impressive family of thermal gap filler pads with these next-generation offerings.”
Typical applications extend from automotive electronics and lighting LEDs, telecommunications equipment, to power conversion systems, consumer electronics, servers, desktop/laptop computers, handheld devices and memory modules. The products are also extremely effective in vibration-dampening applications.
