Parker Chomerics


EMI shielding gasket for defence and commercial use

The Chomerics Division of Parker Hannifin Corporation has released a new low-durometer EMI shielding gasket for use in defence and commercial electronics applications. CHO-SEAL 129

Passives | 03-07-2025

Thermal interface materials and prototyping facility unveiling at show

The Chomerics Division of Parker Hannifin Corporation presents a trio of new thermal interface materials at Electronica 2024. Innovations on show will include new thermal cure-in-p

Industrial | 05-11-2024

New high-performance thermal pads protect EV battery packs

The Chomerics Division of Parker Hannifin Corporation has released its new THERM-A-GAP PAD 30 thermally conductive gap filler pads, a high-performance solution for EV battery packs

Automotive & Transport | 30-07-2024

Thermal gels prove reliable in vertical and high-vibration applications

The Chomerics Division of Parker Hannifin Corporation has released two high-performance, high-reliability, fully cured dispensable thermal gels. The new THERM-A-GAP GEL 35VT and TH

Test & Measurement | 08-12-2023

New microwave absorber material reduces electromagnetic radiation in high-frequency applications

The Chomerics Division of Parker Hannifin introduces its CHO-MUTE 9009 microwave absorber material. Comprising a silicone elastomer matrix with a carbon filler, the material provid

Test & Measurement | 06-11-2023

Dispensable thermal gel excels in thin bond line applications

The Chomerics Division of Parker Hannifin Corporation introduces a new thermal interface material for very thin bond lines without compromising performance. THERM-A-GAP GEL 50TBL i

Power | 14-08-2023

New Gap filler pad offers extremely high thermal conductivity

The Chomerics Division of Parker Hannifin Corporation has released its new THERM-A-GAP PAD 80 high-performance gap filler pad. This innovative product supplies designers of electro

Power | 17-07-2023

High-flow thermal gel released for high-volume applications

The Chomerics Division of Parker Hannifin Corporation unveils a new thermal interface gel that is excellent for all manufacturers facing the challenges of high-throughput productio

Test & Measurement | 13-06-2023

New generation of non-silicone dispensable thermal gels

The Chomerics Division of Parker Hannifin Corporation has released THERM-A-GAP GEL 40NS, the next iteration in its silicone-free, thermally conductive gels. This one-component, low

Industrial | 26-01-2023

Protecting drones with EMI shielding and thermal interface materials

Parker Chomerics has released new solutions to protect drones from EMI and overheating. Drones functioning near cell phone towers, buildings, antennae, high-voltage power lines and

Subs & Systems | 17-05-2022

Conductive elastomer engineering handbook offers complete guide to EMI shielding

The new edition of Parker Chomerics Conductive Elastomer Engineering Handbook has been revised, making it simpler than ever to choose the correct materials and products for any EMI

Subs & Systems | 28-02-2022

Next generation of high-performance thermal gap filler pads

The Chomerics division of Parker Hannifin Corporation has introduced its next generation of thermal gap filler pads - THERM-A-GAPTM PAD 30 and 60 - for all heat transfer applicatio

Subs & Systems | 29-12-2021

CAD models for conductive elastomer extrusion profiles help speed design cycles

The Chomerics division of Parker Hannifin Corporation simplifes life for design engineers across the world by adding an expansive database of more than 11,000 CAD models and drawin

Design & Manufacture | 30-11-2021