05-11-2024 | Parker Chomerics | Industrial
The Chomerics Division of Parker Hannifin Corporation presents a trio of new thermal interface materials at Electronica 2024. Innovations on show will include new thermal cure-in-place, gap pad and dispensable gel products. The company is also planning a notable announcement involving launching a rapid sampling and prototyping service.
With ever-evolving demands and trends in the electronics industry, the company strives to remain ahead of the competition by developing timely solutions to emerging challenges. The new thermal interface materials on display maximise thermal management performance in some of the most demanding applications, overcoming key industry issues such as oil bleed, vertical tackiness and the limitations of hard-curing dispensables.
Thermal interface materials transfer heat away from electronic components and other heat-generating devices. They also perform gap-filling duties in certain applications. The new THERM-A-FORM CIP 60 cure-in-place material and thermal gap filler are a case in point. With its high 6W/m-K thermal conductivity, the new product not only delivers an appealing alternative to hard-curing dispensable materials in electronics cooling applications, but it also improves standard application methods associated with thermal gap filler pads.
Visitors to the booth will discover that this two-component material can supply an exceptional flow rate and meet high-volume dispensing needs. E-mobility systems, automotive infotainment, automotive ADAS, and consumer and enterprise SSDs can all benefit from THERM-A-FORM CIP 60.
The company will also display its new THERM-A-GAP 80LO high-performance thermal gap pad with very low oil bleed and migration characteristics. Ideal where the aesthetic or manufacturing issues of silicone oils are an issue, the new gap pad offers a typical thermal conductivity of 8W/m-K. A compressible thermal elastomer conducts heat in gaps between a heat-generating surface like a semiconductor or battery and a heat-dissipating surface.
The thermal gap pad minimises stress on components like integrated circuits and provides physical protection such as vibration damping. Applications include GPUs, CPUs, memory modules, 5G, and telecommunications equipment. Automotive sensors, devices, battery and energy storage modules, and defence electronics can also benefit.
Another new product highlight will be THERM-GAP GEL 75VT, a high-performance dispensable thermal gel offering 7.5W/m-K typical thermal conductivity and vertical tackiness for demanding and mission-critical applications. In long-term reliability tests, the new material passed automotive vertical slump testing, high-vibration tests and telecommunications thermal material verification processes.
The single-component thermal gel is ideal for automotive sensors and devices, telecommunications modules, BESS modules, industrial electronics, network and IT infrastructure, power electronics, and consumer electronics. Users can dispense the thermal gel at bond line thicknesses up to 4mm.
Visit the company at electronica 2024, booth B3.236, November 12-15.
