High-flow thermal gel released for high-volume applications

The Chomerics Division of Parker Hannifin Corporation unveils a new thermal interface gel that is excellent for all manufacturers facing the challenges of high-throughput production. Providing flow rates of up to 100g/min, the new THERM-A-GAP GEL 60HF (‘High Flow’) thermal gel is ideal for companies manufacturing consumer electronics, telecommunications equipment, energy storage devices, power supplies and semiconductors, automotive control units and sensors, and computing components such as CPUs and GPUs.

The company optimised this fully cured gel for automated dispensing at different packaging sizes while retaining properties for easy rework and field repair. The paste-like consistency of the gel also allows very tightly controlled dispensing and accurate material placement throughout the assembly. Notably, the product needs low compressive force to deflect under assembly pressure, minimising stress on components, soldered joints, and PCB leads.

Despite its high flow rate attributes (far more than other products in this materials family), the product presents no compromise in performance with superior, long-term thermal stability and reliability ensured for all users. A thermal conductivity of 6.2W/m-K facilitates optimal heat transfer from electronic components to cooling features.

For convenience, users may store and transport this single-component gel at room temperature, while a further benefit includes no post-cure requirements, further helping manufacturers with high-throughput production demands.

“For example, mobile phone manufacturers with short takt times can achieve flow rates of up to 100g/min alongside good wetting-out properties that adhere well to the substrate in support of fast dwell times,” explains Ben Nudelman, global market manager, Chomerics Division.

“Throughput of several hundred pieces per hour is possible with THERM-A-GAP GEL 60HF, depending on the specific application. Furthermore, with low deflection force, there is no chance of the product causing PCB distortion.”

As a final note, the company can optimise the package to suit any existing dispensing equipment.