08-06-2022 | Infineon | Subs & Systems
Infineon Technologies AG offers the next-generation XENSIV MEMS microphones defining a new industry standard. The microphones IM69D127, IM73A135 and IM72D128, are the most recent additions to its growing microphone portfolio. Together with selectable power modes, the MEMS microphones are an excellent match for consumer electronics, including headphones with ANC, TWS earbuds, conference devices with beamforming capability, tablets, laptops, or smart speakers with voice-user-interfaces. Use cases also incorporate selected industrial applications such as predictive maintenance and security.
The microphones are created to capture audio signals with the highest precision and quality. They are based on the company's latest Sealed Dual Membrane (SDM) MEMS technology, which provides high ingress protection (IP57) at a microphone level. The sealed MEMS design stops water or dust from entering between membrane and backplate, bypassing mechanical blockage or electric leakage issues commonly seen in MEMS microphones. Also, microphones built with SDM technology can be employed to create IP68 devices with the highest protection class needing only minimal mesh protection.
The analog microphone IM73A135 provides a best-in-class SNR of 73dB(A) and an excellent AOP of 135dB SPL. Its digital counterpart, the IM72D128, provides an SNR of 72dB(A) and an AOP of 128dB SPL. IM69D127 offers similar performance condensed into a tiny 3.6mm x 2.5mm2 package. Further, all devices provide exceptionally low distortions (THD) even at high sound pressure levels, very tight part-to-part phase and sensitivity matching, and flat frequency response with a low FRO, an ultra-low group delay, and selectable power modes.
