Expanded hybrid FPC-to-board connector now offers ultra-low-profile version

Hirose has enhanced its hybrid FPC to board connector product family with a 30-position ultra-low-profile version. The BK10 Series connector offers a 0.5mm stacking height and a 1.7mm width, delivering significant space savings. Combining a miniature design with a tough, fully armoured housing makes the series excellent for various portable and wearable electronic devices.

A metal shell shields the series’ robust housing to stop housing damage due to misalignment when mating. Multi-point soldering enhances PCB peeling strength, while a dimpled lock design on the contacts supplies a high extraction force. The power and signal contacts provide a two-point contact design, ensuring high contact reliability.

The connector design effectively utilises end spacing to extend the self-alignment range when mating. Easy mating is attained through a wide self-alignment range of ±0.29mm in the pitch direction and ±0.24mm in the width direction.

“Hirose continues to expand its comprehensive hybrid FPC-to-board product family to give designers more options that meet the challenging application requirements that portable, handheld, and wearable devices demand,” said Mark Kojak, chief marketing officer and senior vice president of Sales and Operations for Hirose Electric USA. “The BK10 Series is our latest FPC-to-board connector that offers a space-saving, fully armoured design to ensure long operational life in mobile device applications.

The hybrid series offers 30 signal positions rated at 0.3A and two power contacts rated at 5A. The connector is generally employed for portable devices like audio players, cameras, laptops, gaming consoles, and wearable devices such as earbuds, smartwatches, and smart glasses.

The series has a rated voltage of 30V AC/DC and an operating temperature of -55C to +85C.