Chipset amplifies gaming and photography smartphone experiences

MediaTek has launched the Dimensity 7200, its inaugural chipset in the new Dimensity 7000 series. The device provides cutting-edge AI imaging features, powerful gaming optimisations, and outstanding 5G speeds, all with deeply engrained power savings for longer battery life.

The chipset provides the same TSMC 4nm second-generation process seen in the Dimensity 9200 and is excellent for ultra-slim designs in various form factors. The octa-core CPU incorporates two Arm Cortex-A715 cores, providing operating speeds of up to 2.8GHz, with six Cortex-A510 cores, so users can easily multitask and take advantage of peak performance in every app. To further optimise power and performance, the company's built-in AI Processing Unit (APU) maximises the efficiency of AI tasks and AI-fusion processing.

"The MediaTek Dimensity 7000 series will be vital for mobile gamers and photography enthusiasts who are looking for an affordable way to squeeze the most battery life out of their phones without skimping on performance," said CH Chen, deputy general manager of MediaTek's Wireless Communications Business Unit.

For gamers, the MediaTek HyperEngine 5.0 technology provides AI-based Variable Rate Shading for power savings, CPU and GPU smart resource optimisation for better battery life, and other upgrades for smooth gameplay. The chipset also incorporates a powerful Arm Mali G610 GPU that supports fast response times and sustains high frame rates.

Utilising the company's Imagiq 765 and a 14-bit HDR-ISP, the chipset supports 200MP main cameras for epic photography. It allows impressive video capturing with 4K HDR video and lets users simultaneously capture content from two cameras at Full HD resolution whilst keeping everything focused with all-pixel autofocus technology. The chipset has built-in motion-compensated noise reduction to allow users to capture stunning imagery at night and in low-light environments. Also, the APU supports powerful AI-Camera enhancements, including real-time portrait beautification.

The chipset has a 3GPP Release-16 standard Sub-6GHz 5G modem with up to 4.7Gbps downlink and supports triband Wi-Fi 6E connectivity and next-gen Bluetooth 5.3. The fully integrated 5G modem and the company's 5G UltraSave 2.0 technology suite provide best-in-class cellular power efficiency. For reliable coverage everywhere, the chipset supports 2CC Carrier Aggregation and Dual 5G SIM with dual VoNR. The Dual SIM capability allows users to have two connections, making it simple to take work and personal calls from a single smartphone.