Partners produce a 650V silicon carbide rectifier module for power applications

Nexperia has partnered with Kyocera AVX Components to jointly produce a new 650V, 20A SiC rectifier module for high-frequency power applications ranging from 3kW to 11kW power stack designs aimed at applications like industrial power supplies, EV charging stations, and onboard chargers. This release will further deepen the existing, long-lasting partnership between the two companies.

Space-saving and weight reduction are the key necessities for manufacturers of the next-generation power applications. This new SiC rectifier module's compact footprint will help maximise power density, thereby decreasing the needed board space and lowering the overall system cost. Thermal performance is optimised using a combination of TSC and an integrated NTC sensor, which monitors the device temperature and provides real-time feedback for device or system-level prognosis and diagnosis. This rectifier module has a low inductance package to enable high-frequency operation, and it has been qualified to operate with a junction temperature of up to 175C.

"This collaboration between Nexperia and Kyocera AVX combines cutting edge silicon carbide semiconductors with state-of-the-art module packaging and will allow Nexperia to better serve the market demand for power electronic products which offer exceptionally high levels of power density," according to Katrin Feurle, senior director of the Product Group SiC at Nexperia. "The release of this rectifier module will represent the first step in what is envisaged as a long-term SiC partnership between Nexperia and Kyocera AVX".

Thomas Rinschede, deputy vice president, Sensing and Control Division at Kyocera AVX Components Sensing and Control Division, comments: "We are delighted to further extend our successful partnership with Nexperia into the production of silicon carbide modules for power electronics applications. Nexperia's manufacturing expertise combined with Kyocera module know-how make a compelling offering for customers looking to achieve higher power densities using wide bandgap semiconductor technology."