Stackable multi-row BTB connector platform snaps together without solder

ENNOVI addresses the growing demand for high-density interconnects in challenging automotive application scenarios. The new ENNOVI-MB2B multi-row board-to-board (BTB) connector platform provides a proprietary ‘snap-in biscuit’ design, allowing multiple connector units to be stacked together without solder. This unique, cost-effective approach accommodates different pin count requirements through the same basic interconnect platform without any extra expense or engineering effort.

The new multi-row BTB connectors feature the company´s patented 0.4mm miniPLX press-fit terminals made from a copper alloy that exhibits very low levels of contact resistance (<1mOhm). Each pin has a 3A current carrying capability. The optional coating of these pins with the company’s patented IndiCoat plating technology mitigates tin whisker build-up, stopping the risk of short circuits and expanding operational lifespan.

These connectors are offered in board stacking heights from 7mm to 30mm. They can have between one and six rows, with up to 30 contact terminals included in each row. Conforming with automotive performance requirements, these rugged products can withstand high humidity levels (eight-hour cycling up to 10% RH), mechanical shock (35g for 5ms to 10ms across ten axes), and vibration (eight hours per axis). A working temperature range of -40C to +150C is supported.

“Being able to fit enough interconnect terminal pins into a small space, while not having any excess, is a priority for any of our clients. At the same time, keeping their total cost of ownership down is also vital,” explains Ralph Semmeling, product portfolio director at ENNOVI. “This means that the companies we are dealing with want access to off-the-shelf products at attractive price points but with the inherent flexibility that following a custom-based strategy offers. Our new ENNOVI-MB2B stackable interconnect platform gives them the best of both worlds. Allowing them to design at cost.”

The robust, high-density, scalable multi-row BTB connectors will be targeted at a wide variety of applications. Among the most prominent are EVs, particularly for EPS and ECU functions.