Revolutionary flip-chip die bonder faster than current market leaders

ITEC has released the ADAT3 XF TwinRevolve flip-chip die bonder, which runs five times faster than existing machines and can attach up to 60,000 flip-chip dies per hour. The company aims to help manufacturers lower their factory footprint and running costs by facilitating higher productivity with fewer machines, achieving a more competitive Total Cost of Ownership (TCO).

The bonder is designed with precision in mind, with an accuracy better than 5μm @ 1σ. This level of precision, combined with its ultra-high throughput, opens possibilities for a whole new generation of products where flip-chip assembly was once too slow and expensive. Flip-chip packages can also contribute to more dependable products with lower power consumption and better high-frequency and thermal management performance than conventional wire bonds.

Instead of the traditional forward and backward up/down linear motion, the new die bonder employs two rotating heads ('TwinRevolve') to pick, flip and place the die in a fast, smooth action. This unique mechanism lowers inertia and vibration, allowing for the same accuracy at higher speeds. This development opens up new opportunities for chipmakers to transition their high-volume wire-bonded products to flip-chip technologies.

"We believe our new ADAT3 XF TwinRevolve flip-chip die bonder represents a significant step forward in the manufacturing of advanced flip chips and chiplets, aligning with the vision for the future of factory operations", says Mark van Kasteel, commercial director at ITEC. "Its automated features, coupled with a design that requires significantly less space, contribute to a reduction in maintenance, operational hours, and energy consumption, ultimately leading to a smaller carbon footprint."

An autoloader for strip magazines (in-outgoing) takes four magazines at a time and has an option for E142 substrate mapping. The machine also has an automatic wafer change with a barcode reader. It accepts 8" to 12" (200mm to 300mm) wafers. It has full die traceability, auto recipe download (MES interface), and a SECS/GEM interface.

A separate flux screen printer can be added as an inline-setup or the TwinRevolve can run as a standalone tool with strip magazine input/output, a flux screenprint inspection module is an option. The die bonder is also equipped with full servo-controlled bond-force/pick-force settings and auto-diagnostics to monitor machine health. Five high-resolution (up to 5MP) cameras at key process points help keep operation under close control. They monitor glue, pre-pick, back/front side, post-bond and optional sidewall. Flux-related inspection includes drop size, shape, and coverage concerning Cu pillar size.

The die bonder accepts several types of QFN, DFN, HVQFN, SOT, SO, TSSOP, and LGA leadless and leaded packages and can handle a 100mm x 300mm strip size.