ITEC has released the ADAT3 XF TwinRevolve flip-chip die bonder, which runs five times faster than existing machines and can attach up to 60,000 flip-chip dies per hour. The compan
Semiconductors | 05-06-2024
ITEC's ADAT3 XF Tagliner is the industry's fastest and most accurate RFID inlay die bonder. Offering placement speeds of up to 48,000 Units Per Hour (UPH), with positional and rota
Semiconductors | 23-11-2023
