FPC/FFC-to-board connector features centre lock design for rugged applications

25-10-2024 | Hirose | Automotive & Transport

Hirose has designed a two-piece FPC/FFC-to-board connector for harsh environment applications including automotive. Featuring a centre lock design, the TF70 Series permits easy, one-handed insertion and removal, providing durable performance with a locking strength of more than 40N. A guide key prevents mis-insertion, and a clear tactile click indicates complete and proper mating.

Assembly involves inserting the FPF/FFC into the plug housing and securing with the retainer, improving efficiency and decreasing complexity. This design eradicates traditional terminals, reducing weight and conserving space using FPC/FFC instead of discrete wires. The design includes safe design features to prevent electric shock, mis-insertion, and incorrect mounting, addressing key safety concerns in automotive electronics.

The series has a narrow pitch of 0.5mm and a compact design that greatly reduces the size and weight of end products. Its operating temperature of -40C to +105C makes it ideal for automotive and other harsh-environment applications.

The series is available for flexible board design in right-angle and straight-angle connection methods.

“The TF70 Series FPC/FFC-to-board connector offers space-savings that enables a reduction in size of electronic devices without sacrificing performance and durability,” said Pete Lais, assistant vice president of Product Management for Hirose Electric Americas. “Its compact size, reliability, and safety features make it an ideal choice for a wide range of automotive applications, from infotainment systems to advanced driver assistance technologies.”

The connector is obtainable in a 50-position version.

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By Seb Springall

Seb Springall is a seasoned editor at Electropages, specialising in the product news sections. With a keen eye for the latest advancements in the tech industry, Seb curates and oversees content that highlights cutting-edge technologies and market trends.