No-clean zero-halogen lead-free solder paste has extra durability solder alloy

SHENMAO America, Inc. has announced its PF925-P250 No-Clean Zero-Halogen Lead-Free Solder Paste. Developed to fulfil the needs of high-reliability applications, paste delivers outstanding performance and enhanced durability.

The paste was developed to meet the necessity for high-reliability solder solutions in demanding applications. The PF925 alloy (Sn-Ag-Cu-In-Bi), patented by Panasonic, is specially designed to improve reliability. The inclusion of Indium (In) and Bismuth (Bi) in the solder matrix forms a solid solution in the Sn matrix, greatly increasing strength and reliability compared to traditional SAC solders. With better thermal stress resistance and the ability to prevent cracks in solder joints, paste ensures durability even under extreme conditions. Furthermore, its lower melting point compared to SAC solders adds to its versatility and application range.

The PF925-P250 solder paste stands out with its halogen-free (ROL0) composition, containing no intentionally added halogens. Fully compliant with RoHS, RoHS 2.0, and REACH regulations, this innovative solder paste fulfils stringent environmental and safety standards. Its specially formulated flux provides superior low-voiding performance, particularly with challenging components such as BGAs, QFNs, and MOS devices that need large ground pad contact. Also, the solder paste delivers exceptional solderability and excellent wettability, ensuring reliable and consistent performance across the board.

This advanced solder paste is excellent for products that use the SMT process and demand high reliability. Its robust features and excellent performance make it a perfect solution for industries such as automotive, aerospace, consumer electronics, and other sectors where precision and durability are critical.