Industrial


New cable assemblies deliver superior RF performance

Fairview Microwave has released a line of TCOM cable assemblies. They are designed to provide outstanding RF performance with options tailored for either low-loss or low-PIM configurations, depending on the connector type. The cable asse

Fairview Microwave | 23-01-2025

Plug-in partner for cable connectors in demanding industrial applications

Demanding industrial applications require compact, robust connectors that can reliably transmit high currents and voltages. binder now offers the perfect solution: special flange components act as plug-in partners for the PBC15 cable connec

Binder | 23-01-2025

Observability driven development for embedded software

Percepio AB has launched Percepio Detect, a groundbreaking tool that redefines how embedded software developers tackle testing, debugging, and observability challenges. Supporting the new best practice of Observability Driven Development (O

Percepio | 23-01-2025

New 7" touch display offers long operational life

Inelco Hunter has announced the availability of their new 7" Touch Display, featuring a 24-bit RGB interface with a long operational life of 20,000 hours MTBF. The 7" size is particularly suited to applications needing a long-life, high-bri

Inelcohunter | 23-01-2025

AI-based high-resolution depth sensor for close imaging sets new records

Kyocera Corporation introduces a high-resolution AI-based depth sensor that is utilised to measure tiny objects that have been difficult to measure, utilising conventional depth-sensing technologies. Its new camera delivers record-setting d

Kyocera AVX | 23-01-2025

Single-row 1.27mm connectors and cable assemblies for industrial and EV applications

Harwin has expanded its Kontrol range of industrial board-to-board interconnects (BBi), adding single-row connectors and cables to the 1.27mm pitch (0.05") connectors. The range has been designed to bridge the gap between high-end connector

Harwin | 22-01-2025

MEMS-based ultrasound transducer enables new industrial and medical use cases

Infineon Technologies AG has made notable progress in developing the capacitive micromechanical ultrasonic transducers (CMUT) technology. The technology allows the company to manufacture the first integrated one-chip solution for a MEMS-bas

Infineon | 22-01-2025

Compact haptic reactor achieves a 90% reduction in size

Alps Alpine has released the compact Haptic Reactor 'U-Type', which achieves approximately 90% size reduction (by volume) compared to its predecessors. Maintaining high-vibration performance, this new model can be installed in tight spaces

Alps Alpine | 22-01-2025

All-in-one display features a customisable user interface

Rutronik is expanding its portfolio to include the DLC0210RHCS-1 from DLC Displays Co. Ltd. This TFT display is round with an integrated rotary knob, a resolution of 480 x 480 dpi and a user interface (UI) that can be customised. With a siz

Rutronik | 22-01-2025

High-performance BLE 5.4 modules for energy-sensitive wireless applications

Mouser now stocks the HCM511S BLE 5.4 modules from Quectel. These high-performance Bluetooth modules feature an Arm Cortex-M33 processor running up to 76.8MHz and support BLE 5.4. The modules have 32KB RAM and up to 512KB flash memory. M

Mouser Electronics | 21-01-2025

New high-resolution reflectometer released

Yokogawa Test & Measurement Corporation has released its AQ7420 high-resolution reflectometer. Using OLCR (optical low-coherence reflectometry) technology, the device is ideal for the internal structure analysis of optical modules and t

Yokogawa | 21-01-2025

Infrared thermometer revolutionises induction hob design

Melexis has unveiled the MLX90617, an infrared thermometer for non-contact temperature measurements in induction hob applications. This breakthrough sensor uses optical filtering to measure the temperature of the cooking vessel's base via t

Melexis | 21-01-2025

New 2.4GHz radio modules are compact and energy-saving

Würth Elektronik offers new wireless modules: the freely configurable Orthosie-I model and the Stephano-I variant with pre-installed firmware. Both are based on the ESP32-C3 chipset and communicate according to the IEEE 802.11 b/g/n and Blu

Wurth | 21-01-2025

Global LTE Cat 4 smart modems for high bandwidth connectivity in OEM/IoT apps

Mouser now stocks Digi XBee 3 Global LTE Cat 4 smart modems. Engineered to swiftly allow higher bandwidth cellular connectivity and provide easy-to-add-on functionality for various OEM devices or IoT gateways, modules are an excellent fit f

Mouser Electronics | 20-01-2025

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