Alphawave Semi


First 3nm UCIe IP with TSMC CoWoS packaging launched

Alphawave Semi has launched the industry's first successful 3 nm silicon bring-up of Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) IP with TSMC's Chip-on-Wafer-on-

Semiconductors | 01-08-2024

Connectivity for high-performance compute and AI infrastructure

Alphawave Semi has announced a 9.2Gbps HBM3E subsystem (PHY + Controller IP) silicon platform. Based on the company's proven HBM3E IP, the platform takes chiplet-enabled memory ban

Industrial | 26-06-2024

Off-the-shelf chiplet for HPC and AI iinfrastructure

Alphawave Semi has announced the successful tape-out of the industry's first off-the-shelf multi-protocol I/O connectivity chiplet on TSMC's 7nm process. Aggregating the company's

Semiconductors | 20-06-2024