Zymet’s reworkable edgebond adhesive, UA-2605-B, has been shown to enhance the board level reliability of a large WLCSP. The work has been performed and published with additional
Products | 05-06-2017
A new approach to enhancing the board level reliability of area array packages was presented at the recent SMTA International, an industry-leading conference on electronics assem
15-10-2015
