AVX Corporation has released a new series of SMD thin film chip capacitors especially designed to meet demanding performance specifications in automotive signal and power applications. Qualified to AEC-Q200, their new automotive grade Accu-

AVX | 21-02-2017

Amphenol Advanced Sensors, available from TTI Europe, provides and array of sensing products for automotive EV/HEV battery temperature sensing (BTS) and industrial portable power applications. The devices offer reliable and accurate tem

TTI Europe | 16-02-2017

Allegro MicroSystems has introduced a new N-Channel power MOSFET driver capable of isolating a three phase load by controlling the in-phase isolation MOSFETS. Their A6862 motor driver IC is intended for automotive systems that must meet A

Allegro | 16-02-2017

The LMV551-Q1 is a high performance, low power operational amplifier implemented with Texas Instrument’s advanced VIP50 process. The device features 3MHz of bandwidth while consuming only 37µA of current, which is an exceptional bandwidth t

Texas Instruments | 14-02-2017

Renesas Electronics has announced the E2 Emulator, a new-generation on-chip debugging emulator. The E2 is intended as a development environment for the latest devices in the company’s RH850, RX, and RL78 families of MCUs, and for a selectio

Renesas | 13-02-2017

Panasonic Automotive and Industrial Systems Europe has extended its range of NFC tags with a new IC for battery less RF communication which is compliant with JISX6319-4 (212kbps/424kbps), ISO/IEC14443 TypeA (106kbps), and ISO/IEC14443 TypeB

Panasonic | 13-02-2017

U-blox has announced its Untethered 3D Dead Reckoning (UDR) GNSS module NEO-M8U is at the core of Navilock’s new GNSS receiver series. The new portfolio will enable retrofitting of Dead Reckoning (DR) and Untethered Dead Reckoning (UDR) tec

U-Blox | 10-02-2017

Renesas Electronics has announced the development of a circuit technology dedicated for motor control that realizes green vehicles satisfying stricter automotive CO2 emissions requirements. The newly developed technology is an Intellige

Renesas | 09-02-2017

The Texas Instruments DS90UB934-Q1 FPD-Link III deserializer, in conjunction with the DS90UB913A/933-Q1 serializers, supports the video transport needs with an ultra-high-speed forward channel and an embedded bidirectional control channel.

Texas Instruments | 03-02-2017

Fujitsu Electronics Europe has launched its new FRAM solution MB85RS256TY. It is the first component of a completely new product group which is designed for an operating temperature of up to 125C and is qualified according to the AEC Q100 i

Fujitsu | 03-02-2017

The AURIX TC275 microcontroller from Infineon and available now from RS Components is a triple TriCore 32-bit device with many features designed to help your design meet the Functional Safety standard of ISO 26262 ASIL-D for automotive ADAS

RS Components | 30-01-2017

Available from Digi-Key, Analog Devices’ ADSPSC58X and ADSP-2158X family of dual core 450MHz SHARC DSP come with and without single ARM Cortex-A5 processors. Each part comes with SHARC SRAM with up to 640kB. Ideal applications include a

Digikey | 25-01-2017

TDK Corporation has expanded its CGA series of automotive-grade MLCCs for high-temperature applications. New MLCCs with X8L temperature characteristics have been introduced and the capacitance range of its existing X8R types has been extend

TDK | 25-01-2017

Delivering more available memory, Bluetooth 5-ready hardware, automotive qualification and a new ultra-small wafer-chip-scale package (WCSP) option, Texas Instruments has two new devices in its scalable SimpleLink Bluetooth low energy wire

Texas Instruments | 23-01-2017