Nanusens has announced the first IP license agreement for its MEMS-in-ASICs technology with Azoteq, a pioneer in high-volume sensor fusion ICs employed in industrial and consumer applications. The company's technology allows its MEMS IP

Nanusens | 22-06-2023

Infineon Technologies AG has introduced its first generation of ISOFACE dual-channel digital isolators to fulfil the growing demand for rugged high-voltage isolation. The new devices are pin-to-pin compatible with other suppliers' portfolio

Infineon | 22-06-2023

Transtector has released a new line of power cords for various computer networking equipment. The cords have features to make installations more functional, such as twist-lock connectors, right-angle connectors and splitter cords. The ne

Transtector | 22-06-2023

Mouser now stocks the RZ/T2L high-performance microprocessor with EtherCAT from Renesas Electronics. Optimised for high-speed processing and high-precision real-time control for applications adopting EtherCAT communication protocols, the de

Mouser Electronics | 21-06-2023

ROLEC’s ‘round’ technoDISC plastic enclosures for IIoT and Industry 4.0 electronics are now supplied in four sizes. Robust enclosures are ideal for a broad range of industrial electronics. Its ‘round’ design is ideal for automation syste

Rolec Enclosures | 21-06-2023

Toshiba Electronics Europe GmbH offers four new motor driver ICs. The series comprises two constant-current dual H-bridge drivers for driving up to two motors each and a pair of two-phase bipolar stepping motor driver ICs. All four new driv

Toshiba Electronics | 21-06-2023

Anritsu Company introduces the ShockLine ME7869A distributed modular two-port VNAs that can execute long-distance full vector S-parameter measurements over wide distances of up to 100m. Three models – operating up to 8GHz, 20GHz, and 43.5GH

Anritsu | 21-06-2023

Teledyne FLIR has released the FLIR E8 Pro, providing a larger 3.5" touchscreen with FLIR Ignite Cloud connectivity within the same pistol-grip form factor as legacy E8 series thermal cameras. Users can share captured images with colleagues

Teledyne FLIR | 21-06-2023

Bota Systems is participating at automatica, the event for smart automation and robotics. At the event, the company will present its latest innovation – an extremely sensitive and compact six-axis force-torque sensor. Developed with precisi

Bota Systems | 21-06-2023

Pasternack has released its latest RFID antennas. The additions are developed to amplify RFID applications, including asset tracking, inventory control, identification validation and more. The state-of-the-art antennas function within th

Pasternack | 20-06-2023

Pickering Interfaces has launched a new range of PXI/PXIe RF MUX modules providing a new switching technology. Excellent for wireless communications and semiconductor tests, the new MEMS-based RF multiplexers produce vastly increased operat

Pickeringtest | 20-06-2023

Guerrilla RF, Inc offers the formal release of the GRF5526, GRF5526W, GRF5536 and GRF5536W, the latest in a series of ¼W linear power amplifiers. These InGaP HBT amplifiers were developed especially for 5G wireless infrastructure applicatio

Guerrilla RF | 20-06-2023

Toshiba Electronics Europe GmbH has released the TLP3476S. This new photorelay offers a maximum turn-on time of 0.25ms – a 50% decrease over the company’s existing TLP3475S photorelay and allows greatly enhanced switching capabilities. Obta

Toshiba | 20-06-2023

Leuze has developed the 53C and 55C series for hygiene-sensitive production and packaging processes. The sensor series are suited to hygiene-sensitive production and packaging processes. A special design, high leak tightness, and resistance

Leuze | 20-06-2023