Industrial


Right-angle crimp socket for popular wire-to-board connector series

Hirose has extended its DF60 Series to include a rugged right-angle crimp socket that provides design flexibility and space-savings in demanding, power-hungry applications. Providing a compact design, the right-angle DF60FS Series crimp soc

Hirose | 10-04-2024

Ultrafast soft recovery diode modules offer improved life expectancy

Vishay Intertechnology, Inc. has introduced two new FRED Pt 500A Ultrafast soft recovery diode modules in the new TO-244 Gen III package. Delivering higher reliability than previous-generation solutions, the Vishay Semiconductors VS-VSUD505

Vishay | 10-04-2024

Wireless MCU targets Bluetooth 5 Low Energy and Zigbee

The SimpleLink CC2340R2 device is a 2.4GHz wireless MCU targeting Bluetooth 5 Low Energy and Zigbee. The device is optimised for low-power wireless communication as an entry-level SoC, allowing a wide range of end products in categories suc

Texas Instruments | 10-04-2024

New series of power capacitors for operating temperatures up to +105C

TDK Corporation offers a new series of EPCOS power capacitors for DC link applications developed for an operating temperature of up to +105C. The components with the ordering code B25695E can function at rated DC voltages from 700V to 1300V

TDK | 10-04-2024

Global collaboration expands access to ML development

Mouser has announced a new global partnership with Edge Impulse, a cutting-edge development platform that enables ML on edge devices. Edge Impulse provides advanced intelligence to a wide range of products and devices, from low-power MCUs t

Mouser Electronics | 09-04-2024

Panel PC delivers efficiency and reliability for semi-outdoor applications

DFI has released its latest KS101-EHL industrial touchscreen PC, designed for reliability and durability in semi-outdoor applications. Supplied with energy-efficient Intel Atom Processors, the Panel PC provides the high performance demanded

DFI | 09-04-2024

Three-cell devices offer greater energy potential and power output than single or dual-cell parts

Knowles' Cornell Dubilier brand has announced its latest EDLC modules, or supercapacitor modules, are now available through New Yorker Electronics. Based on Knowles' Cornell Dubilier brand DGH and DSF Series supercapacitors, these cutting-e

New Yorker Electronics | 09-04-2024

New SPDT toggle switches with SMA connectors bring flexibility and easy operation

Pasternack has released its latest innovation, SPDT toggle switches with SMA connectors. These switches are designed to satisfy the demands of high-frequency applications up to 26GHz. Built with precision and reliability in mind, the SPD

Pasternack | 09-04-2024

Intelligent vision ecosystem launched

Arrow Electronics, Inc. is using the onsemi IAS module standard to develop intelligent vision solutions for robotics, machine vision, commercial cameras, and other applications. The solution decreases the complexities of designing a prod

Arrow | 09-04-2024

High-power reed relays offer alternative to mercury wetted reed relays or electromechanical relays

Pickering Electronics has released its latest high-power reed relay, Series 144, featuring an impressive 80W power rating while stacking on a compact 0.25" pitch. The SIP reed relay delivers a switching current of up to 2A, delivering up to

Pickering | 09-04-2024

First BLE and Matter wireless MCU to feature neural co-processor for AI/ML workloads

Alif Semiconductor has launched the Balletto family, the world’s first BLE wireless microcontroller to feature hardware optimisation for AI/ML workloads. Supplied in an ultra-small WLCSP package, the MCU allows manufacturers to implement

Alif Semiconductor | 09-04-2024

Multiprotocol module for wireless IoT applications

Mouser now stocks the LBEE5PL2DL multiprotocol module from Murata. The multiprotocol module is a Type 2DL Wi-Fi + Bluetooth module that supports Wi-Fi 6 (IEEE 802.11a/b/g/n/ac/ax) + Bluetooth 5.3 BR/EDR/LE specifications. This small, hig

Mouser Electronics | 08-04-2024

Primary battery for portable and small electronic devices in customisable blister packs

The CR2032 Li-MnO2 cells from EEMB are provided in blister packs of five, which, depending on the project volume, can be customised according to customer specifications. Blister packs have the advantages of straightforward handling and the

Rutronik | 08-04-2024

Industry's first general-purpose 32-bit RISC-V MCUs with internally developed CPU core

Renesas Electronics Corporation has released the industry's first general-purpose 32-bit RISC-V-based MCUs built with an internally developed CPU core. While many MCU providers have recently joined investment alliances to advance the develo

Renesas | 08-04-2024