Application interface boards allow designers to try out rugged and easy-to-use GaN HEMTs

30-05-2023 | Cambridge GaN Devices | Test & Measurement

Cambridge GaN Devices (CGD) has released a range of Application Interface Boards that enable designers to try out the company’s rugged, easy-to-use ICeGaN HEMTs in existing circuits instead of competing MOSFET or GaN devices without needing to re-layout the PCB. The boards are adaptor PCBs soldered to an ICeGaN device, which map each pin/signal from the ICeGaN HEMT footprint to the corresponding pins/signals of an alternative component footprint.

Peter Comiskey, director of Application Engineering, CGD said: “These Application Interface Boards are designed for design and evaluation purposes only, of course. This is a quick, first step to enable the user to put one of our ICeGaN ICs into an existing design. There is some minor impact on thermal performance, but surprisingly little difference in EMC or electrical performance.”

The company provide the boards for several industry-standard devices from leading MOSFET and GaN device manufacturers. A full list are available on the user guide, but the company is happy to create an application interface board for devices not currently supported for delivery within four weeks.

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By Seb Springall

Seb Springall is a seasoned editor at Electropages, specialising in the product news sections. With a keen eye for the latest advancements in the tech industry, Seb curates and oversees content that highlights cutting-edge technologies and market trends.