12-12-2023 | Microchip Technology | Industrial
Microchip Technology's expansive portfolio of SP1F and SP3F power modules are now available with Press-Fit terminals for high-volume applications.
Solder-free Press-Fit power module terminals permit automated or robotic installation, simplifying and speeding up the assembly process to lower manufacturing costs. The high accuracy of the terminal locations and the novel design of the power modules allow high-reliability contact with the printed circuit card. A Press-Fit power module solution can save valuable time and production costs.
There are over 200 variants available in the company power modules portfolio, with options to use mSiC technology or Si semiconductors and an array of topologies and ratings. The terminals are provided in the voltage range 600V-1700V and up to 280A.
With this technology, the power module pins are not soldered to the PCB. Instead, the electrical connection is made by pressing the pins into properly sized PCB holes. A key advantage of a Press-Fit power module solution is that it removes the need for wave soldering. This is especially important when the PCB is made also to include SMT components.
"Our power modules with Press-Fit terminals offer customers the flexibility to fully customise their design and are cost-effective power solutions for high-volume production," said Leon Gross, vice president of Microchip's discrete products group. "This type of plug-and-play power solution also provides a highly reliable mounting solution for automated or robotic assembly."
The highly configurable power modules are fully compliant with the RoHS.
