Compact module for high-performance AI applications at the edge

congatec has introduced new COM Express Compact COMs with AMD Ryzen Embedded 8000 Series processors. Based on the dedicated computing cores of the new Ryzen processors, which feature up to eight 'Zen 4' cores, innovative XDNA NPU, and powerful Radeon RDNA 3 graphics, the new modules produce an impressive performance of up to 39 tera operations per second (TOPS) for AI inference.

This makes the new conga-TCR8 Type 6 modules especially appealing for high-volume, price-sensitive applications requiring a combination of advanced AI, graphics, and computing power. OEMs in medical imaging, test and measurement, AI-supported POS/POI systems, and professional gaming can employ these long-term available COM Express Compact modules to accelerate innovation while ensuring investment security. With a broad, scalable TDP range of 15W to 54W, these modules are also ideal for upgrading existing designs. Companies can bring their products to the latest state of the art by simply replacing modules, greatly improving lifecycle, ROI, and sustainability.

"Our new AMD Ryzen Embedded 8000-based modules not only expand our range of high-performance edge AI platforms for innovative applications but also offer developers easy access to system consolidation benefits in the aReady.COM variant. This new processor platform, featuring powerful CPU, GPU, and NPU cores, is perfectly suited for such consolidation. Customers and users benefit from cost, efficiency, and reliability advantages thanks to a configured hypervisor, pre-installed operating systems, accompanying IoT software for enhanced functionality, and flexible expansion options," explains Martin Danzer, director product management at congatec.

The new COMs have four different AMD Ryzen Embedded 8000 processors featuring six or eight 'Zen 4' cores. They support up to 128GB DDR5-5600 memory with ECC for data-intensive and data-critical applications. The integrated AMD XDNA NPU (16 TOPS) and AMD Radeon RDNA 3 graphics, which can also be used as a GPGPU for AI tasks with up to 12 compute units, deliver a combined computing power of up to 39 TOPS. They also support immersive graphics output on up to four displays with resolutions as high as 8k. They offer six PCIe Gen 4 (eight lanes) for fast peripheral connectivity with PEG x8 Gen 4, three DisplayPort interfaces, one eDP or LVDS, four USB 3.2 Gen 2 ports, and four USB 2.0 ports. Audio signals are delivered via HAD, and mass storage can be integrated through two SATA 6Gb/s ports or an optional NVMe SSD directly on the module. Classic embedded interfaces such as SPI, UART, I2C, and GPIO complete the feature set.

The new modules are also available as application-ready aReady.COMs, with custom pre-installed and validated operating systems like ctrlX OS, Ubuntu and/or RT Linux, optional system consolidation via aReady.VT, and IoT connectivity via aReady.IOT. On request, the modules can be pre-installed with the customer's application, enabling simple plug-and-play integration into the finished system.

Moreover, the company's high-performance ecosystem and design-in services simplify the application development process. The service offering includes comprehensive board support packages, evaluation and production-ready application carrier boards, customised cooling solutions, extensive documentation and training, and high-speed signal integrity measurements.