Gate driver board aimed at automotive/EV and industrial applications

27-06-2023 | Mouser Electronics | Automotive & Transport

Mouser now stocks the Si828x-BAWB-KIT gate driver board for XM3 from Skyworks Solutions, Inc. Planned to replace more complex power stage designs with a simpler, cost-effective solution, the board is Skyworks' next-generation isolated gate driver board (GDB) reference design optimised for SiC FETs.

The board provides an enhanced GDB layout ideal for Silicon SiC FETs such as the XM3 half-bridge module from Wolfspeed, which operates in tandem with the company's GDB to significantly enhance power density and power efficiency for demanding automotive applications such as HEVs, EV drivetrains, and EV fast chargers, and industrial motor drives, power supplies, and AC, brushless and DC motor controls.

The gate driver board combines the robust GDB short-circuit protection features with the rugged SiC XM3 module to better protect the high voltage/high current module from overload and circuit damage and effortlessly execute the power switching stage of a system. The gate driver board was specifically designed to protect the power module during a short circuit event, detecting any load fault and shutting off the power module in under a microsecond.

The board includes two of the company's Si828x isolated gate drivers (the Si8284 and Si8285) in a half-bridge configuration. The kit supplies two isolated power supplies, a peak output current of +20A/-30A and a CMTI of 125kV/µs. The isolation voltage is 5kV, and the solution provides desaturation detection and Miller Clamp protection for the FETs. Status indicator LEDs and test points are supplied to ease the evaluation and prototyping process.

The half-bridge module supplies a high-power density footprint with half the weight and volume of a standard 62mm module, low inductance (6.5nH), integrated temperature sensing and a dedicated Drain-Kelvin Pin. The module executes a conduction-optimised, third-generation MOSFET technology that maximises the benefits of SiC while minimising loop inductance and allowing simpler power bussing which keeps the system design robust, simple and cost-effective. Together, the module and GDB enhance power density over prior modules and discrete approaches to deliver a complete, pre-tested and proven solution for the market.

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By Seb Springall

Seb Springall is a seasoned editor at Electropages, specialising in the product news sections. With a keen eye for the latest advancements in the tech industry, Seb curates and oversees content that highlights cutting-edge technologies and market trends.