21-03-2024 | Diodes Inc | Power
Diodes Incorporated has announced that its SDT2U30CP3 (30V/2A), SDT2U40CP3 (40V/2A), and SDT2U60CP3 (60V/2A) attain the industry’s highest current densities in their class with low forward voltage drop and thermal resistance meeting design challenges for smaller and more efficient portable, mobile, and wearable devices. This series of innovative high-current trench Schottky rectifiers is housed in a CSP that occupies only 0.84mm² board space. They can be employed for various purposes, such as blocking or reverse-polarity protection diodes, boost diodes, and switching diodes.
The trio are the first ever 2A trench Schottky rectifiers to be designed into the X3-DSN1406-2 package, making these the industry’s smallest in their class. Compared with similar SMB-packaged devices, they occupy a mere 3.4% of the PCB area. These ultra-thin CSPs, offering a typical profile of 0.25mm, also shorten thermal paths. This results in enhanced power dissipation, ultimately reducing thermal BOM costs and greatly increasing overall system reliability.
Their ultra-low forward voltage performance, typically 480mV (580mV for the SDT2U60CP3), minimises power losses, allowing the design of higher efficiency systems. They have superior avalanche capability compared to other products in the same range, providing robustness in extreme operating conditions, such as transient voltages, and enabling an extra layer of reliability. Also, these devices are lead-free and compliant with RoHS 3.0 standards, contributing to environmentally responsible designs.
