New high-performance COM's integrated IIoT capabilities create added value

congatec is showcasing numerous new COMs at embedded world. These innovations include new Intel Core Ultra processor-based modules with integrated AI, and premieres based on innovative low-power and high-performance x86 processor technology will be featured. The presentations will focus on increased performance, energy efficiency, and integrated advanced IIoT and security functions, which have yet to be part of any existing COM offering before now. These will greatly increase the application readiness of COMs and contribute to the particularly efficient and reliable development of modern, multifunctional, and comprehensively connected embedded and IIoT devices and differentiate the company's offering from alternative procurement options.

"IIoT presents OEMs with major challenges, which we, as a Computer-on-Modules supplier, are now addressing with a significantly expanded range of functions of our COM-HPC, COM Express, SMARC and Qseven-based modules. For example, module-integrated hypervisor technology and IIoT functionality make it easier for solution providers to enrich their applications, bringing increased functionalities without having to develop or integrate them themselves. We will highlight the added value we offer OEM customers through these newly created functionalities at embedded world," explains Tim Henrichs, vice president marketing at congatec.

Embedded systems from OEMs must cover significantly more functionalities to fulfil all digitalisation and IIoT connectivity necessities. The company addresses these high demands on OEM solutions with its in-house hypervisor technologies and edge IoT functionalities, among other things. The advantages of the seamless integration of this range of solutions into the extended feature set of COMs will be presented for the first time at embedded world.

The expanded IIoT functions for COMs are the logical consequence of the company's value-added strategy. The company is a pioneer when it comes to extended functions and services for the most simplified integration of COM Express, COM-HPC, SMARC and Qseven-based modules. Its high-performance ecosystem provides sophisticated cooling solutions optimised for the individual modules, and carrier boards for easy evaluation and application design, as well as accompanying software support and individual integration services. Furthermore, its testing and design services save OEMs extra time and work. All this makes the integration of modules more straightforward and efficient and offers engineers a high level of design security. Customers benefit from faster time-to-market and can, therefore, master the ever-shorter innovation cycles in the best possible way.

As well as all functional areas from the processor and form factor functions, the company's modules offer comprehensive efficiency and convenience for OEMs. The newly integrated virtualisation, digitalisation and security functions set a new benchmark in terms of the range of capabilities of application-ready COMs, particularly for real-time IIoT applications.

embedded world, Hall 3, Booth 241, 9 - 11 April 2024.