26-10-2023 | Samtec | Industrial
Samtec has released its vertical solderless compression mount connectors incorporating precision alignment features. Spanning DC to 90GHz, the new connectors are ideal for use in high-frequency test and measurement applications and are obtainable in full production quantities.
The connectors come standard with precision alignment features exclusive to the company and ensure peak connector performance. The solderless launch (where the connector is compressed onto the PCB using mounting hardware) permits easy, field-replaceable, cost-effective assembly to the PCB and eradicates possible performance degradation commonly found with solder reflow.
This new line of connectors includes both threaded and push-on interface types 135 Series – 35mm (90GHz), 185 Series – 85mm (65GHz), 240 Series – 2.4mm (50GHz), 292 Series – 92mm (40GHz), and GPPC Series - CMM option – SMPM (65GHz).
“In extremely high-frequency test and measurement applications, compression mount connectors have become the connector of choice. Samtec has noticed that when compression mounting, slight misalignment between the connector and the landing pad can occur, causing signal degradation. While at lower frequencies, this degradation is minor, at high frequencies, it can become problematic yet very difficult to detect. This has been observed even when mounting screws are tightened to proper torque specifications.” says Dan Birch, global RF engineering manager at Samtec. “To prevent this issue, alignment features are now standard with all Samtec vertical compression mount RF products.”
The company has released its vertical GPPC Series with a -CMM solderless option for differential pair test and measurement applications. It is the only ganged, solderless connector of its kind in the industry. The push-on coupling design enables quick-attach for ease of use in a lab setting.