14-05-2024 | CUI Devices | Industrial
CUI Devices’ Thermal Management Group has announced the expansion of its BGA heat sinks line. Compatible with BGA devices, the HSB family now offers aluminium or copper material options, clean or black anodised material finishes, and adhesive or PCB mounting styles. All BGA heat sink models are conveniently measured under four conditions for thermal resistance, making it simpler for designers to choose the optimal heat sink for their natural convection or forced air-cooled system.
mmSupporting a wide range of sizes from 8.5mm x 8.5mm up to 69.7mm x 69.7mm with profiles from 5 to 25mm, the company' BGA heat sinks feature thermal resistances from 3.45 to 39.1C/W at 75C ΔT in natural convection and power dissipation ratings from 1.92W up to 21.74W at 75C ΔT in natural convection.
The company's website offers helpful resources and tools on heat sinks, including blog posts, videos, and more.
