New thermal design services employ advanced simulation tools

CUI Devices' Thermal Management Group has launched its new thermal design services. With a team of thermal management experts, its industry-leading thermal design services employ advanced simulation tools and decades of expertise to determine potential hotspots, optimise airflow, and design effective cooling systems tailored to customers' needs. The available services offered are further broken down as follows:

Thermal simulation: The company employs the latest computational fluid dynamics techniques to accurately predict and optimise airflow, temperature distribution, and heat transfer in multifarious systems.

Manufacturing capabilities: As well as standard thermal management products, the company has the manufacturing capabilities to design custom thermal management solutions, including product customisations and integrations.

Thermal management consulting: From conducting PCB modelling and optimisation to providing expertise in system, housing, and chassis design, the company can help designers maximise their thermal management strategy.

Thermal testing and validation: The thermal testing services ensure the accuracy and reliability of a thermal design via real-world testing to help identify and address any potential discrepancies.

"Thermal challenges are an inescapable fact in today's electronic devices," stated Steve Mathis, CUI Devices' VP of Sales. "Our new thermal design services are a natural progression of our existing portfolio of thermal management products. We also have many years of experience collaborating with customers to tailor custom thermal solutions to their specific application needs, and we believe these additional services will further simplify their design journey."

Helpful resources and tools on thermal management can be found in the company's Resource Library, housing a range of blog posts, videos, and more.