02-05-2024 | Kioxia | Industrial
KIOXIA Europe GmbH has announced that it has begun sampling its latest UFS Ver generation. 4.0 embedded flash memory devices. Supported in capacities of 256GB, 512GB, and 1TB, the new products are ideal for various next-generation mobile applications, including leading-edge smartphones.
The enhanced performance of the new UFS products supplies optimal utilisation of 5G connectivity, resulting in accelerated downloads, minimised latency, and an improved user experience. A smaller package size contributes to board space efficiency and design flexibility.
Key features include a read/write speed improvement of approximately +15% sequential write, +50% random write, and +30% random read over the previous generation. It offers a package size reduction of 9mm x 13mm over the previous generation, and the package thickness is 0.8mm (256GB and 512GB) and 0.9mm (1TB), resulting in an approximate 18% reduction compared to the conventional package size (11mm x 13mm).
The latest UFS Ver. 4.0 devices integrate the company's innovative BiCS FLASH 3D flash memory and a controller in a JEDEC standard package. UFS 4.0 incorporates MIPI M-PHY 5.0 and UniPro 2.0 and supports theoretical interface speeds of up to 23.2Gbps per lane or 46.4Gbps per device. UFS 4.0 is backwards compatible with UFS 3.1.
"KIOXIA's UFS technology is the 'racehorse equivalent' of the company's family of embedded storage devices. With our next-generation UFS 4.0, we have doubled the random write and increased random reads by 30%," said Axel Störmann, vice president and chief technology officer for Embedded Memory and SSD, KIOXIA Europe GmbH. "As development continues, we are proud to help accelerate mobile communication."
