Small photorelay for high-frequency signal switching

Toshiba Electronics Europe GmbH has released a new photorelay specifically engineered to decrease insertion loss and suppress power attenuation of high-frequency signals. The new device is aimed at use in semiconductor testing applications, including high-speed memory testers, high-speed logic testers or probe cards.

The new TLP3475W has lowered parasitic capacitance and inductance through optimised package design, thereby decreasing insertion loss of signals in the frequency range 20GHz (typ.). This represents a 1.5x improvement in performance over the existing TLP3475S device.

The current (IFT) needed to drive the LED is <3mA, and on-state resistance (RON) is typically 1.1-Ohm. The isolation voltage (BVs) exceeds 300Vrms, and output capacitance (COFF) is less than 20pF, adding to switching times in the region of 2ms. It provides a normally open (NO)/1-Form-A function.

The new device is housed in a WSON4 package measuring just 1.45mm x 2mm x 0.8mm (typ.), making it one of the smallest photorelays presently available. This is 40% smaller than the company's ultra-compact S-VSON4T package and is of special value in multi-channel designs where multiple devices are deployed on a single card.

The operating temperature range is -40C to +110C, making it appropriate for industrial applications, including high-speed semiconductor testing.