27-09-2024 | Molex | Industrial
Molex has introduced a thermal management solution that decreases the time and cost of deploying and upgrading high-performance data centres to meet unrelenting demand for generative AI and machine learning workflows. Molex VaporConnect Optical Feedthrough Modules for two-phase immersion cooling address constant increases in data centre speed and capacity by employing a unique, cassette-based design that bolts directly onto immersion tanks and allows optical transceivers and network cabling infrastructure to be swapped out without changing mechanical interfaces or impacting immersion tank architecture.
"Molex continually embraces innovative optical solutions to ease data centre deployments and upgrades while alleviating critical thermal management challenges," said Trevor Smith, general manager of Optical Connectivity, Molex. "VaporConnect gives customers the flexibility to upgrade connectivity and scale cooling system designs to keep pace with data centre growth by simply deploying a different module, which will accelerate upgrades while reducing overall energy, cooling and technology costs."
These Optical Feedthrough Modules simplify the connections between optical transceivers contained within immersion tanks and cabling infrastructure outside the tank using fully upgradeable sealed modules. With VaporConnect, sealing and cabling are achieved inside the module, allowing customers to upgrade connectors without impacting immersion tank design or architecture. Also, customers can reuse standard cabling infrastructure for multiple product generations, reducing deployment time, cost and complexity.
For single and multi-mode fibre solutions, a full range of industry-standard and company-owned optical connector form factors is available. These solutions also feature mix-and-match functionality to enable system upgrades to newer or denser connectors. Customisable module footprints are available to fit specific space and application requirements.
See Molex at ECOC'24 on Stand C75. As a participating member in OIF, it is part of an interoperability demonstration, which takes place at Booth B83, to spotlight optical networking innovations and solutions for data centres, AI/ML technologies, and disaggregated systems.