High-density LGA solderless open-field vertical compression connectors

Astute Electronics is stocking Airborn Electronics' new RZ Series of high-density LGA solderless open-field connectors. The RZ Series features a patented Z-axis contact system and is designed to be compressed under pressure between parallel PCBs or between the PCB and other electronic components. The vertical surface-mount PCB compression connectors are ultra-reliable, due to their one-piece contact system. The RZ Series has beryllium copper contacts with gold over nickel finish at 1.27mm spacing, and is available in contact sizes 20 - 175 (2 - 7 rows and 10 - 25 columns). Available heights are 2.54mm to 8.89mm. Electrical characteristics include current rating of 0.5A and typical contact resistance of 25mohm, depending on contact height. Insulation resistance is 5000Mohm minimum at 100VDC.