New leadless NTC thermistor dies offer same mounting options as IGBT semiconductors

Vishay has introduced two new leadless NTC thermistor dies - contacted on the top and bottom - that provide designers with the same mounting options as IGBT semiconductors. Featuring gold metallization, the NTCC300E4 supports gold wire bonding and conductive adhesive gluing, while the NTCC200E4 with silver metallization supports aluminium wire bonding and is compatible with reflow soldering and nano-silver paste sintering. The devices are optimized for temperature sensing, control, and compensation in automotive and industrial applications. End products will include IGBT modules, power inverters, motor drives, and hybrid integrated circuits for electric vehicles and hybrid electric vehicles, solar panels, and wind turbines. Packaged in conductive PS blister tape and resistant to leaching, the NTCC300E4 and NTCC200E4 offer high stability over a wide temperature range of -55C to +175C, with a drift of <3% after 1,000 hours. The devices are highly resistant to thermal shocks, with a drift of <3% after 1,000 cycles in accordance with AEC-Q200 automotive standards. The RoHS-compliant thermistors offer resistance at +25C (R25) from 4.7kohm to 20kohm, with tolerance down to ±1%, and beta (B25/85) from 3435K to 3865K, with tolerance down to ± 1 %. The devices feature maximum power dissipation of 50mW and response times of 5s. Samples of the NTCC300E4 and NTCC200E4 are available now, says the company.