Ultra-compact Bluetooth low energy modules on a tiny 4.6mm x 5.6m x 1mm footprint
21-05-2015 |
Mouser Electronics
|
Subs & Systems
The TDK SESUB-PAN-T2541 Bluetooth v4.0 module is now available from Mouser
stock. The ultra-compact Bluetooth low energy modules offer a tiny 4.6m x
5.6mm x 1mm footprint.
The module is based on proprietary semiconductor embedded in substrate
(SESUB) technology. The Bluetooth die is embedded into a thin substrate
along with a quartz resonator, bandpass filter, and capacitors. The module
needs only a power supply and antenna. The Bluetooth v4.0 LE specifications
significantly reduce power consumption of battery powered devices, and are
ideal for wireless healthcare, sport, fitness, home entertainment, and
wearable devices, says the company.
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