High-speed monolithic low-voltage CMOS DDR3L SDRAM
25-09-2015 |
MSC
|
Semiconductors
Alliance's new monolithic high-speed, low-voltage CMOS double data rate
three synchronous DRAM (DDR3L SDRAM), with an 8-Gb density in the 96-ball,
9mm x 14mm lead (Pb)-free FBGA package, is now available from MSC.
Featuring state-of-the art silicon provided by Micron Technology, Inc., the
AS4C512M16D3L (512M x 16) offers a double data rate architecture for
extremely fast transfer rates of up to 1600 Mbps/pin and clock rates of
800MHz.
With minimal die shrinks, the single-die 8Gb DDR3L SDRAM provides a reliable
drop-in, pin-for-pin-compatible replacement for a number of similar
solutions used in conjunction with newer-generation microprocessors for
industrial, medical, networking, telecom, and aerospace applications -
eliminating the need for costly redesigns and part requalification. This 8Gb
DDR3 is a logical choice for those requiring increased memory yet face board
space constraints.
The AS4C512M16D3L operates from a single +1.35V power supply and is
available with a commercial temperature range of 0C to +95C
(AS4C512M16D3L-12BCN) and an industrial temperature range of -40C to +95C
(AS4C512M16D3L-12BIN). The device is internally configured as eight banks of
512M x 16 bits.