Ultra-compact Bluetooth Low Energy modules feature 4.6mm x 5.6mm x 1mm footprint
15-12-2015 |
Mouser Electronics
|
Subs & Systems
Mouser now stocks TDK's SESUB-PAN-T2541 ultra-compact Bluetooth v4.0 Low
Energy modules in a 4.6mm x 5.6mm x 1mm footprint. The SESUB-PAN-T2541 is
based on TDK's proprietary SESUB technology (semiconductor embedded in
substrate) and is suitable for use in wearable devices. The Bluetooth die is
embedded into a thin substrate along with a quartz resonator, bandpass
filter, and capacitors. The module needs only a power supply and antenna.
The Bluetooth v4.0 LE specifications significantly reduce power consumption
of battery powered devices, and are ideal for wireless healthcare, sport,
fitness, home entertainment, and wearable devices.
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